Huawei Ascend P8 will have metal chassis, Specs leaked

We have got some news about upcoming Huawei Ascend P8. Rumors suggest that the Huawei’s next flagship device will follow the tradition of an impressively thin design built around a metal chassis. It also suggested that Huawei Ascend P8 will feature a 5.2″ 1080p display and run on the HiSilicon Kirin 930 chipset built on TSMC’s 16nm process and packing an octa-core processor within.

Now we have got some leaked images of the Huawei Ascend P8. Nowhereelse.fr released some images of Huawei’s next flagship device, leaked images confirmed the rumors that Huawei Ascend P8 will have super thin metal chassis. A deep examination of the leaked pictures reveal yet another super thin frame, but at the moment we cannot predict the actual measurement of the device.

Huawei Ascend P8

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The carved out holes in the leaked images gives us an idea about the camera of Huawei Ascend P8, the camera will feature a single-LED flash. Whereas the Huawei Ascend P8 device will come with the two ejectable trays. The first tray will be the primary SIM slot for sure, while the second one may be either for a second SIM or for a microSD memory card. We will not be surprised if this is a case forsecond tray. Because earlier we have seen Huawei combined the SIM and memory slot into a single tray and the users choose what to use inside, so this might be the case with the Huawei Ascend P8 as well.

Huawei Ascend P8

Huawei is thinking to bring its next year flagship device at CES 2015 in Las Vegas or it will be released at MWC expo in March 2015 in Barcelona, Spain.

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Huawei Ascend P8

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