The Snapdragon 820 is sought to solve the overheat issue faced by users of devices with older Qualcomm chipsets. However the efficiency of the new chipset is yet to be ascertained meanwhile we have a number of reports that suggest the issue may remain unsolved in new chipset version in upcoming devices.
This emerged after alleged pics of the fourth generations Motorola Moto X surface with heat pipes inside. The alleged pics are showing the prototype of the 4th gen Moto X. We have recently seen a number of devices employing heat pipes to coup with the overheat issue faced with certain Qualcomm chipsets.
The overheat issue was reported in the older Snapdragon chipset versions which was expected to get solved after upgrades. However many still faces the issue as devices like OnePlus 2, Xperia Z5 and Xiaomi Mi Note Pro used heat pipes despite the upgraded Snapdragon 810 SoC. But fresh reports are showing many upcoming devices with Snapdragon 820 SoC having heat pipes too.
The alleged Samsung Galaxy S7 is also expected with the latest version of Qualcomm chipset but a recent report shows it with heat pipes as well. Though we are not sure yet about the version of chipset in the upcoming Moto X but considering its expected arrival period chances are high for Snapdragon 820. Therefore the presence of heat pipes strengthen the doubts of its potential users.
According to the reports the next generation of Moto X is not on the list to unveil before second quarter of the year. Thus we have much time to get the 4th Gen Moto X in out hand, meanwhile we may find it without heat pipes. Samsung also got multiple chipset options to lover the expectancy of loses. Though nothing is confirmed yet but the hints are raising much concerns about the issue in future devices.