Samsung Galaxy S7 chipset will have internal heat pipes to overcome overheating issues

Overheating issues have been the among top concerns with key chipsets which forced manufacturers for effective counter measures. A heat pipe may help cooling down the chipset, and Samsung seems to have considered this option seriously with Galaxy S7 chipset after Sony experimented the same in the Sony Xperia Z5 successfully. A fresh report circulating in Asian circles shows Samsung considering a heat pipe with its upcoming Galaxy S7.

 

The concerns with overheating chipsets came to light few months back while Qualcomm was planning to launch its snapdragon 820 Chipset.

 

The concerns with overheating chipsets came to light few months back while Qualcomm was planning to launch its snapdragon 820 Chipset. As per a rumor the new SoC was claimed to have some serious kind of overheating issues. However the rumors were quickly rejected by the company ruling out any such issue with the newer Snapdragon 820.

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But aside from company claims, there have been similar issues with the Snapdragon 810 to reinforce concerns with upcoming Qualcomm chipsets. The company has also denied reports of overheating on Snapdragon 810 despite the huge number of evidences reported by its users. On the other hand, Samsung ditched the use of Snapdragon 810 for the same heating issues in Galaxy S6 and S6 Edge.

Samsung did not use the Snapdragon chipset in Galaxy S6 and S6 Edge due to overheating issues.
Samsung did not use the Snapdragon chipset in Galaxy S6 and S6 Edge due to overheating issues.

After some reports suggesting the Galaxy S7 a reality, now we have overheating measures expected on the upcoming Galaxy device. Yet the development is under process and reports are suggesting various heat pipes under testing for the Galaxy S7 chipset. We may get some official release or at-least solid reports by the end of year.

The concept of heat pipe is not new and also Samsung Galaxy S7 will not be the first to get a heat pipe. The heat pipe solution to chipset overheating has been already adopted by Sony, Xiaomi and the OnePlus devices. The heat pipe tech is used in the devices of these vendors with Snapdragon 810 chipset.

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We have recently discussed reports about the Samsung Galaxy S7 expected in two version with Exynos 8890 and Snapdragon 820 SoC. Though the overheating remains a potential issue with other chipsets too but for the Snapdragon SoC use of heat pipe is quite likely.

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