Samsung’s Unpacked 2016 event has been discussed several times, particularly for the expected arrival of the Galaxy S7. The Unpacked event is scheduled for February 21, just a day before this year’s Mobile World Congress MWC. There have been enough speculations about the arrival of Galaxy S7 at the event and now fresh hints suggest that it will also make its way to the US by March 11.
The Galaxy S7 has been long awaited with rumors suggesting unusual features on board. The day to expect the Galaxy S7 is about a month ahead but the rumors have already revealed much about the features that the upcoming Samsung flagship is going to introduce.
Considering the details from latest rumors, the upcoming Galaxy S7 is going to be a 5.1inch display device with resolution of 1440x2560pixels. The internal specs are made a little different on two of its variants on the base of the region of availability. For the users in the US and Chinese markets, the Galaxy S7 comes with Snapdragon 820 chipset while for the rest of the world it carries Exynos 8890 chipset.
The Galaxy S7 is reported to carry 4GB RAM while its internal storage is expected to be 64GB, as mentioned by AnTuTu. With others strong features its camera powers are made good as per the trending devices. On rear panel the Galaxy S7 carries a 12megapixel main camera and on front there is a 5megapixel camera for selfies.
With some key differences the Galaxy S7 will be joined by a larger Galaxy S7 Edge model with curved display. The larger Galaxy S7 edge will arrive with a curved display of 5.5inch size and 1440x2560pixels resolution. With these specs details the upcoming Galaxy S7 is also reported to bring some of the older Galaxy features back into life. Therefore, we can expect it with microSD slot and water and dust protection of the Samsung Galaxy S5.