Sony Xperia Z5 came into market formally with some surprises and many familiar details. On lower side, we find many parts of the Xperia Z5 matching with the older Xperia Z3 and Z4. And among the matching specs the main part evident in internal details is the Qualcomm Snapdragon 810. Yes the same chipset which many have reported with unwanted issues. But you don’t need to worry as Xperia Z5 is well-equipped to deal with the possible issues of its chipset.
The issue with Snapdragon 810 has been discussed so many times. And it was the same reason that we all have been expecting the Xperia Z5 with upgraded chipset. But Sony instead of upgrades over the chipset has done some other arrangements for the potential issues. To prevent the it from overheating; the key issue reported with Qualcomm chipset, Sony has introduced a cooling mechanism.
Few days after the Xperia Z5 with its two other models, the Xperia Z5 Premium and Xperia Z5 Compact we have an unofficial teardown. The treatment was done with the prime model of Xperia Z5 and the Xperia Z5 Premium. The device with 4K video support and other high features will obviously face heating issues which remain will prime concerns for its users. Thus the mechanism introduce in the Xperia Z5 devices will keep things cool.
According to details following tear down of both models, we can notice that the devices are equipped with dual heat pipes. The heat pipes work as thermal control for the device. From the inside view of the older Xperia Z3, we can see a single heat pipe but on the Xperia Z5 it is made double for better thermal control. Thus we can assume the devices to remain cool while performing on high levels. And hopefully you will have a satisfactory experience with Snapdragon 810.